sonic-buildimage/device/ingrasys/x86_64-ingrasys_s8900_64xc-r0
Ying Xie 5ab66b191a
[bcm config] remove scache_filename config entry (#2140)
Warm boot is managed by SAI. This configuration entry shouldn't be
included in bcm config.

Signed-off-by: Ying Xie <ying.xie@microsoft.com>
2018-10-12 08:05:38 -07:00
..
INGRASYS-S8900-64XC [bcm config] remove scache_filename config entry (#2140) 2018-10-12 08:05:38 -07:00
plugins [devices]: add stubs for new API in SfpUtilBase for all devices (#2038) 2018-09-12 09:40:29 -07:00
default_sku [updategraph] add support to use preset config instead of default minigraph (#2050) 2018-09-21 22:01:10 -07:00
fancontrol [Ingrasys]: Change hwmon kernel modules installation order (#980) 2017-09-22 12:58:10 -07:00
installer.conf [Ingrasys] Add Ingrasys S8900 series platform (#569) 2017-05-18 11:05:49 -07:00
led_proc_init.soc [platform]: Update LED for Ingrasys platforms (#831) 2017-07-24 17:56:48 -07:00
sensors.conf Remove extra trailing newlines at EOF (#804) 2017-07-12 20:54:37 -07:00